Líquido Removedor Epoxy para CI BGA e Memórias Hua Sheng

El líquid removedor redueix el risc de danyar components sensibles, ja que evita aplicar calor o exercir força física directa sobre els CI o memòries. Permet reblanir l'epoxi en segons (10-15 s), facilitant una retirada més precisa i segura, en comparació amb espàtules o pistoles d'aire calent que poden ocasionar despreniments o sobreescalfament.

Generalment, aquest tipus de removedors conté dissolvents orgànics especialitzats per a epoxi, com acetona industrial i additius. Està dissenyat per fer-se servir en circuits integrats encapsulats, BGAs i memòries, sense afectar plàstic, silicona o estany, tot i que es recomana provar-lo primer en superfícies poc visibles per si de cas.

Si queden residus, podeu repetir l'aplicació puntual del removedor i esperar uns altres 10-15 segons abans d'intentar retirar-los amb delicadesa amb una eina de plàstic. Eviteu instruments metàl·lics que puguin danyar pistes o components. No es recomana rascar amb força.

The remover liquid reduces the risk of damaging sensitive components, as it avoids applying heat or direct physical force to the ICs or memory chips. It softens the epoxy in seconds (10-15 s), making removal more precise and safer compared with spatulas or hot-air guns, which can cause lifting or overheating.

In general, this type of remover contains specialised organic solvents for epoxy, such as industrial acetone and additives. It is designed for use on encapsulated integrated circuits, BGAs and memory chips, without affecting plastic, silicone or tin, although it is recommended to test on less visible areas first just in case.

If residue remains, you can reapply the remover locally and wait another 10-15 seconds before trying to remove it gently with a plastic tool. Avoid metal tools that could damage tracks or components. Forced scraping is not recommended.

The remover liquid reduces the risk of damaging sensitive components, as it avoids applying heat or direct physical force to the ICs or memory chips. It softens the epoxy in seconds (10-15 s), making removal more precise and safer than using spatulas or hot-air guns, which can cause lifting or overheating.

Generally, this type of remover contains specialised organic solvents for epoxy, such as industrial acetone and additives. It is designed for use on encapsulated integrated circuits, BGAs and memory chips, without affecting plastic, silicone or tin, although it is recommended to test on less visible areas first, just in case.

If residue remains, you can reapply the remover locally and wait another 10-15 seconds before trying to remove it gently with a plastic tool. Avoid metal tools that could damage tracks or components. Forced scraping is not recommended.

Remover-vätskan minskar risken för att skada känsliga komponenter eftersom den undviker att man applicerar värme eller direkt fysisk kraft på IC eller minnen. Den gör epoxin mjuk på några sekunder (10-15 s), vilket underlättar en mer exakt och säker borttagning jämfört med spatlar eller varmluftspistoler som kan orsaka lossning eller överhettning.